Wafer-to-wafer bonding has become an enabling semiconductor technology in industries such as 3D packaging, MEMS, MOEMS, and SOI. In a typical wafer bonding process, two flat substrates are permanently joined (bonded) to one another by applying precise combinations of physical pressure, temperature, and/or voltage (Figure 1). Each of the above factors is set depending on the substrate materials being bonded, and the control of these parameters is crucial to a successful, high-quality, high-uniformity manufacturing process.
